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DRA724JGABCRQ1

760-FCBGA (23x23) 1 GHz Arm Cortex-A15 SoC processor with graphics and DSP for automotive infotainment & cluster

Manufacturer NO:

DRA724JGABCRQ1

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Product SN:

10447-DRA724JGABCRQ1

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Package/Case:

760-BFBGA, FCBGA

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Manufacturer Lead Time:

-

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Detailed Descripition:

Multimedia

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Product Application Field:None

Environmental & Export Classifications

Documents & Media

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Product Description

DRA72x ("Jacinto™ 6 Eco") infotainment applications processors are developed on the same architecture as Jacinto 6 devices to meet the intense processing needs of the modern infotainment-enabled automobile experiences.

DRA72x devices offer upward scalability to DRA74x devices, while being pin-compatible across the family, allowing Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly implement innovative connectivity technologies, speech recognition, audio streaming, and more. Jacinto 6 and Jacinto 6 Eco devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution.

Programmability is provided by a single-core Arm® Cortex®-A15 RISC CPU with Neon™ extensions and a TI C66x VLIW floating-point DSP core. The Arm® processor lets developers keep control functions separate from other algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software.

Additionally, TI provides a complete set of development tools for the Arm®, and DSP, including C compilers and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment is available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The DRA72x Jacinto 6 Eco processor family is qualified according to the AEC-Q100 standard.


  • Architecture designed for infotainment applications
  • Video, image, and graphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video inputs and video outputs
    • 2D and 3D graphics
  • Arm® Cortex®-A15 microprocessor subsystem
  • C66x floating-point VLIW DSP cores
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512KB of on-chip L3 RAM
  • Level 3 (L3) and level 4 (L4) interconnects
  • DDR3/DDR3L External Memory Interface (EMIF) module
    • Supports up to DDR3-1333 (667 MHz)
    • Up to 2GB across single chip select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller with DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • Single-core PowerVR™ SGX544 3D GPU
  • One Video Input Port (VIP) module
    • Support for up to four multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-Port Gigabit Ethernet switch
    • Up to two external ports
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Six high speed Inter-Integrated Circuit (I2C™) ports
  • HDQ/1-Wire® interface
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad Serial Peripheral Interface (QSPI)
  • Media Local Bus subsystem (MLBSS)
  • Real-Time Clock subsystem (RTCSS)
  • SATA interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High Speed USB 2.0 dual-role device
  • High Speed USB 2.0 on-the-go
  • Four MultiMedia Card/Secure Digital®/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
  • PCI-Express® (PCIe®) revision 3.0 subsystems with two 5-Gbps lanes
    • One 2-lane Gen2-compliant port
    • or two 1-lane Gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B Protocol
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • Up to 215 General-Purpose I/O (GPIO) pins
  • Device security features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG lock
    • Secure keys
    • Secure ROM and Boot
    • Customer programmable keys (Silicon Revision 2.1)
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA (ABC)
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