SN74ABT16241ADLR

16-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs and 3-state outputs

Manufacturer：

Luminary Micro/Texas Instruments

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Manufacturer NO：

SN74ABT16241ADLR

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Product SN：

10477-SN74ABT16241ADLR

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Package/Case：

SSOP (DL)-48

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Manufacturer Lead Time：

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Datasheet:

SN74ABT16241ADLR Datasheet PDF

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Detailed Descripition：

Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns)

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Product Application Field：None

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Unit Price

Ext Price

1000

$0.551

$551

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Documents & Media

Datasheets PDF SN74ABT16241ADLR Datasheet PDF

Product Description

The 'ABT16241A devices are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and complementary output-enable (OE and OE\) inputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The SN54ABT16241A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16241A is characterized for operation from -40°C to 85°C.

Members of the Texas Instruments Widebus^TM Family
State-of-the-Art EPIC-II B^TM BiCMOS Design Significantly Reduces Power Dissipation
Typical V_OLP (Output Ground Bounce) < 1 V at V_CC = 5 V, T_A = 25°C
Distributed V_CC and GND Pin Configuration Minimizes High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB Layout
High-Drive Outputs (-32-mA I_OH, 64-mA I_OL)
Latch-Up Performance Exceeds 500 mA
Per JESD 17
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings