DRA829JMTGBALFR

827-FCBGA (24x24) Dual Arm Cortex-A72, quad Cortex-R5F, multi-core DSP, 8-port Ethernet switch, and 4-port PCIe switch

Manufacturer：

Luminary Micro/Texas Instruments

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Manufacturer NO：

DRA829JMTGBALFR

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Product SN：

10449-DRA829JMTGBALFR

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Package/Case：

FCBGA (ALF)-827

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Manufacturer Lead Time：

12 Weeks

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Datasheet:

DRA829JMTGBALFR Datasheet PDF

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Detailed Descripition：

Networking

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Product Application Field：None

250 In Stock

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Customer Reference

Quantity

Product price

Qty

Unit Price

Ext Price

1000

$65.17

$65170

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Environmental & Export Classifications

RoHS Status

Not applicable

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN

5A992C

HTSUS

8542.31.0001

Documents & Media

Datasheets PDF DRA829JMTGBALFR Datasheet PDF

Product Description

DRA829 processors, based on the Arm®v8 64-bit architecture, provide advanced system integration to enable lower system costs of automotive and industrial applications. The integrated diagnostics and functional safety features are targeted to ASIL-B/C or SIL-2 certification/requirements. The integrated microcontroller (MCU) island eliminates the need for an external system MCU. The device features a Gigabit Ethernet switch and a PCIe hub which enables networking use cases that require heavy data bandwidth. Up to four Arm Cortex-R5F subsystems manage low level, timing critical processing tasks leaving the Arm Cortex-A72’s unencumbered for applications. A dual-core cluster configuration of Arm Cortex-A72 facilitates multi-OS applications with minimal need for a software hypervisor.

Dual 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2.0GHz
- 1MB shared L2 cache per dual-core Arm Cortex-A72 cluster
- 32KB L1 DCache and 48KB L1 ICache per Cortex-A72 Core
Six Arm Cortex-R5F MCUs at up to 1.0GHz
- 16K I-Cache, 16K D-Cache, 64K L2 TCM
- Two Arm Cortex-R5F MCUs in isolated MCU subsystem
- Four Arm Cortex-R5F MCUs in general compute partition
Deep-learning Matrix Multiply Accelerator (MMA), up to 8 TOPS (8b) at 1.0 GHz
C7x floating point, vector DSP, up to 1.0 GHz, 80 GFLOPS, 256 GOPS
Two C66x floating point DSP, up to 1.35 GHz, 40 GFLOPS, 160 GOPS
3D GPU PowerVR Rogue 8XE GE8430, up to 750 MHz, 96 GFLOPS, 6 Gpix/sec
Memory subsystem:
Up to 8MB of on-chip L3 RAM with ECC and coherency
- ECC error protection
- Shared coherent cache
- Supports internal DMA engine
External Memory Interface (EMIF) module with ECC
- Supports LPDDR4 memory types
- Supports speeds up to 4266 MT/s
- 32-bit data bus with inline ECC up to 14.9GB/s
General-Purpose Memory Controller (GPMC)
512KB on-chip SRAM in MAIN domain, protected by ECC
Display subsystem:
One eDP/DP interface with Multi-Display Support (MST)
- HDCP1.4/HDCP2.2 high-bandwidth digital content protection
One DSI TX (up to 2.5K)
Up to two DPI
Video acceleration:
Ultra-HD video, one (3840 × 2160p, 60 fps), or two (3840 × 2160p, 30 fps) H.264/H.265 decode
Full-HD video, four (1920 × 1080p, 60 fps), or eight (1920 × 1080p, 30 fps) H.264/H.265 decode
Full-HD video, one (1920 × 1080p, 60 fps), or up to three (1920 × 1080p, 30 fps) H.264 encode
Functional Safety:
Functional Safety-Compliant targeted (on select part numbers)
- Developed for functional safety applications
- Documentation available to aid ISO 26262/IEC 61508 functional safety system design up to ASIL-D/SIL-3 targeted
- Systematic capability up to ASIL-D/SC-3 targeted
- Hardware integrity up to ASIL-D/SIL-3 targeted for MCU Domain
- Hardware integrity up to ASIL-B/SIL-2 targeted for Main Domain
- Safety-related certification
  - ISO 26262 certification up to ASIL-D by TÜV SÜD planned
  - IEC 61508 certification up to SIL-3 by TÜV SÜD planned
AEC-Q100 qualified on part number variants ending in Q1
Device security (on select part numbers):
Secure boot with secure run-time support
Customer programmable root key, up to RSA-4K or ECC-512
Embedded hardware security module
Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES
High speed serial interfaces:
Two CSI2.0 4L RX plus one CSI2.0 4L TX
Integrated Ethernet switch supporting up to 8 external ports
- All ports support 2.5Gb SGMII
- All ports support 1Gb SGMII/RGMII
- All ports support 100Mb RMII
- Any two ports support QSGMII (using 4 internal ports per QSGMII)
Up to four PCI-Express (PCIe) Gen3 controllers
- Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
- Up to two lanes per controller
Two USB 3.0 dual-role device (DRD) subsystem
- Two enhanced SuperSpeed Gen1 ports
- Each port supports Type-C switching
- Each port independently configurable as USB host, USB peripheral, or USB DRD
Automotive interfaces:
Sixteen Modular Controller Area Network (MCAN) modules with full CAN-FD support
Audio interfaces:
Twelve Multichannel Audio Serial Port (MCASP) modules
Flash memory interfaces:
Embedded MultiMediaCard interface ( eMMC™ 5.1)
Universal Flash Storage (UFS 2.1) interface with two lanes
Two Secure Digital 3.0/Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0)
Two simultaneous flash interfaces configured as
- One OSPI and one QSPI flash interfaces
- or one HyperBus™ and one QSPI flash interface
System-on-Chip (SoC) architecture:
16-nm FinFET technology
24 mm × 24 mm, 0.8-mm pitch, 827-pin FCBGA (ALF), enables IPC class 3 PCB routing
TPS6594-Q1 Companion Power Management ICs (PMIC):
Functional Safety support up to ASIL-D
Flexible mapping to support different use cases